The machine is designed for cleaning silicon wafers up to 8″ in diameter after lapping process. Maintenance inserts silicon wafers in the carrier into handling basket in the first input two-position bath with water. By two axis manipulator is basket than shifted between two cleaning two washing and one drying bath. After completing the process, basket is transferred by manipulator into output drawer to be taken out by operator.
(machine is used in Czech Republic for USA customer)